The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2019
Filed:
Jul. 23, 2013
Senju Metal Industry Co., Ltd., Tokyo, JP;
Senju Metal Industry Co., Ltd., Tokyo, JP;
Abstract
A soldering apparatus which can keep an interior of a chamber at a specified vacuum pressure and can perform soldering in the chamber, the vacuum pressure of which is optimally adjusted, is provided with a chamber () in which a work () is solderable under vacuum environment, an operation part () that inputs and sets vacuum pressure in the chamber (), a pump () that performs vacuum drawing on the interior of the chamber (), a pressure sensor () that detects pressure in the chamber (), and a control portion () that adjusts the set vacuum pressure in the chamber () based on a pressure detection signal (S) output from the pressure sensor (), and keeps the set vacuum pressure for a predetermined period of time, as shown in FIG.