Senju Metal Industry Co., Ltd.

Tsutomu Hiyama

Hiroyuki Inoue

Hideki Nakamura

Yuta Saito

Takashi Sugihara

Hiroshi Taguchi

Tomotake Kagaya

Toshihiko Mutsuji

Shunsuke Kimoto

Koichiro Hosokawa

Nobuhiro Kojima

Provided is a condensation device capable of removing water vapor from a larger amount of gas without making a size larger than in related art. A condensation deviceaccording to the present invention includes an outer cooling unitincluding one or two or more inner tubes, an outer tubelocated outside the one or two or more inner tubes, and a first flow paththrough which a first cooling medium passes between the one or two or more inner tubesand the outer tube

Condensation device, flux recovery device, soldering device, water vapor removing method, flux recovery method and solder processing method

Provided is a soldering apparatus including: a furnace body including a processing chamber in which boards are processed; a gasket provided at least to a part of the furnace body, and configured to seal the furnace body; a sealed space isolated from the processing chamber, and defined by the furnace body and the gasket; a gas supply apparatus configured to supply a first gas into the sealed space; and a measuring apparatus configured to measure one of pressure in the sealed space and concentration of a second gas in the sealed space.

Soldering apparatus and method of detecting failures of gasket

Provided are a soldering apparatus that allows a gasket to be easily attached to and detached from the soldering apparatus, and a method of fixing the gasket to the soldering apparatus. The soldering apparatus includes: a furnace body; a gasket that is provided to at least a part of the furnace body, and that seals the furnace body; and a push rivet that fixes the gasket in an attachable/detachable manner to the furnace body.

Soldering apparatus and method of fixing gasket to the soldering apparatus

A soldering apparatus includes transfer rails as a first transfer means for transferring a printed circuit board, transfer rails as a second transfer means provided in parallel to a transfer direction of the printed circuit board to be transferred by the transfer rails, a muffle as a first reflow furnace main body for heating the printed circuit board transferred by the transfer rails, a muffle as a second reflow furnace main body for heating a printed circuit board transferred by the transfer rails, and a main frame as a frame for housing the muffle and the muffle. The main frame includes an opening/closing part as a first opening/closing means for opening/closing the muffle, and an opening/closing part as a second opening/closing means for opening/closing the muffle.

Reflow soldering apparatus having independently openable main bodies

To provide a flux recovery device which can remove a flux in a pipe and a method for removing a flux. A flux recovery deviceaccording to the present invention recovers a flux from a gaseous mixture containing a flux component, the flux recovery deviceincluding: a separation unitconfigured to separate the flux from the gaseous mixture using water, and to discharge the water containing the flux; a pipeincluding a second connection port, an inclined portion, and a first connection port, the water containing the flux flowing into the pipefrom the second connection port, the inclined portionbeing positioned on a downstream side of the second connection port, and extending in a direction intersecting with a vertical line extending in a gravity direction, and the first connection portbeing positioned on an upstream side of the inclined portion; and a pumpconfigured to supply water from the first connection port

Flux recovery device, soldering device and method for removing flux

A soldering apparatus including a flux-applying device having a nut that is fitted into the soldering apparatus and the flux-applying device can change a fixed position of the nut easier than that of a convention example even if any adhered matters generated when each apparatus or device is used for a long time are adhered. The nut screws on to the screw shaft having a predetermined length. The nut is provided with at least one non-meshing part that does not mesh with the screw shaft and is formed parallel to a movement direction thereof. The non-meshing part extends from a forward end of the nut to a rear end thereof along whole length of the nut.

Soldering apparatus and flux-applying device

A soldering apparatus which can keep an interior of a chamber at a specified vacuum pressure and can perform soldering in the chamber, the vacuum pressure of which is optimally adjusted, is provided with a chamber () in which a work () is solderable under vacuum environment, an operation part () that inputs and sets vacuum pressure in the chamber (), a pump () that performs vacuum drawing on the interior of the chamber (), a pressure sensor () that detects pressure in the chamber (), and a control portion () that adjusts the set vacuum pressure in the chamber () based on a pressure detection signal (S) output from the pressure sensor (), and keeps the set vacuum pressure for a predetermined period of time, as shown in FIG.

Soldering apparatus and vacuum-soldering method

Provided are a nut, an attachment for nut and a screw shaft, which are fitted to a coating material coating device or a soldering device and can change a fixed position of the nut easier than that of a convention example even if any adhered matters generated when each device is used for a long time are fixed, and a soldering device using the same. The nutscrews on to the screw shafthaving a predetermined length. The nutis provided with a non-meshing partcomposed of a notchthat is formed parallel to a movement direction thereof by cutting off screw threads and a flange portion, which has connecting holesfor connecting another member. Under such a configuration, by forward and/or backward movement of the nut, the notchfunctions as if it scraps the fixed matters

Soldering device

A first water spray unit that sprays water into the gaseous mixture containing the flux component, a separation unit having an introduction port for introducing the gaseous mixture into which water is sprayed from the first water spray unit, and a second water spray unit that forms a precipitation flow inside of the separation unit. The separation unit uses a swirling flow to separate the flow component from the gaseous mixture.

Flux recovery device and soldering device

A flux recovery device that recovers a flux component from a gaseous mixture. The flux recovery device includes a first water spray unit that sprays water into a gaseous mixture containing the flux component, a separation unit that includes an introduction port for introducing the gaseous mixture into which water is sprayed from the first water spray unit, and a second water spray unit that forms a precipitation flow inside of the separation unit. The separation unit uses a swirling flow to separate the flux component from the gaseous mixture. A condensation unit cools water vapor generated in the separation unit to change the water vapor to water droplets, thereby removing the water vapor. Water vapor generated in a separation unit is cooled by a condensation unit, recovered as water droplets, and reused.

In a vacuum soldering apparatus and a control method thereof, in order to prevent flux scattering or solder scattering when voids are defoamed and/or deaerated from molten solder by evacuating a chamber to a target degree of vacuum as well as in order to be able to perform brief evacuation, an evaluation control of a pump is performed. The evaluation control of the pump is performed in which the plural evacuation control properties (#through #) with the gradients &#x3b8; plotting the degrees of vacuum (pressure P) in relation to evacuation time (time t) when a chamber is evacuated by a predetermined pump output, are previously prepared; and the control are changed from evacuation control property of small pump output to evacuation control property of large pump output based on the initially set gradient &#x3b8; in the evacuation control property.

Vacuum soldering apparatus and control method therefor

In a gas-intake-port array structure, which enables any temperature fluctuation during conveying time of a printed circuit board, a semiconductor wafer or the like to be reduced and allows the printed circuit board and the like to be very uniformly heated or cooled, a nozzle pattern Pis arranged to be line symmetry with a nozzle pattern Pin one upper or lower divided section of a nozzle layout region of the nozzle coverrelative to a center portion that is orthogonal to a conveying direction, as shown in FIG.. In order for the arrangement patterns diagonally arranged in the nozzle layout region to become identical, the nozzle pattern Pis arranged to be line symmetry with the nozzle pattern Pin the other upper or lower divided section. Intake portsandeach having a predetermined opening width are arranged between two blowing nozzlesor more and across a first row thereof and plural other rows having different phases, in order to circulate the gas blown from the blowing nozzles. Widths of the intake portsandare set so that they are gradually become narrower with increasing distance from the center portion.

Gas-intake-port array structure and soldering apparatus

In a gas-blowing-hole array structure, which enables gas to be blown to the whole surface of the conveyed member such as a printed circuit board, a semiconductor wafer or the like almost concentrically and allows the whole surface of conveyed member to be very uniformly heated or cooled, a nozzle pattern Pof blowing nozzlesis arranged to be line symmetry with a nozzle pattern Pof the blowing nozzlesin upper and lower divided sections of one side of the nozzle coverrelative to a center portion thereof that is orthogonal to a conveying direction, as shown in FIG.. In order for the arrangement patterns diagonally arranged in the nozzle coverto become identical, the nozzle pattern Pis arranged to be line symmetry with the nozzle pattern Pof the blowing nozzlesin upper and lower divided sections of the other side of the nozzle cover

Gas-blowing-hole array structure and soldering apparatus

A reflow furnace using a conventional heater for blowing hot air has difficulty in reducing &#x394;t and in stabilizing the oxygen concentration at a low level. In addition, it is difficult to uniformly discharge hot air from the discharge holes in a perforated plate of a conventional heater for blowing hot air. In a reflow furnace according to the present invention, the total area per unit area of discharge holes formed in a perforated plate in a heater for blowing hot air installed in a main heating zone is 1.5-5 times the total area per unit area of the discharge holes formed in a perforated plate of a heater for blowing hot air installed in a preheating zone. A heater for blowing hot air has a body divided into three chambers by partitions.

Reflow furnace and heater for blowing hot air

In a conventional reflow furnace equipped with a fume removal device, fume solids adhere to the inside of piping connecting it to the removal device, and a great amount of trouble was required for removal of the fume solids. The present invention maintains a fumes-containing gas discharged from a furnace at a temperature of at least the liquefication temperature of the fumes until the gas reaches a removal device so that fume solids do not adhere to the inside of piping. A removal device installed on a reflow furnace according to the present invention comprises an elongated-hole filter and a labyrinth filter, and fumes are completely removed by both filters.

Growing community of inventors

Tokyo, Japan

Tsutomu Hiyama