The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2024
Filed:
Jul. 26, 2022
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Kyu-Oh Lee, Chandler, AZ (US);
Rahul Jain, Gilbert, AZ (US);
Sai Vadlamani, Chandler, AZ (US);
Cheng Xu, Chandler, AZ (US);
Ji Yong Park, Chandler, AZ (US);
Junnan Zhao, Gilbert, AZ (US);
Seo Young Kim, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/32 (2006.01); H01L 23/498 (2006.01); H01F 41/04 (2006.01); H01L 21/48 (2006.01); H01F 27/28 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01F 27/327 (2013.01); H01F 27/2804 (2013.01); H01F 41/043 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 21/4867 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01F 2027/2809 (2013.01); H01L 21/6835 (2013.01); H01L 24/16 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16267 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19102 (2013.01);
Abstract
Apparatuses, systems and methods associated with a substrate assembly with an encapsulated magnetic feature for an inductor are disclosed herein. In embodiments, a substrate assembly may include a base substrate, a magnetic feature encapsulated within the base substrate, and a coil, wherein a portion of the coil extends through the magnetic feature. Other embodiments may be described and/or claimed.