IDiyas

For the Inventor, By the Inventor

Chandler, AZ, United States of America

Ji Yong Park

USPTO Granted Patents = 24 

Average Co-Inventor Count = 5.5

ph-index = 2

Forward Citations = 8(Granted Patents)


Company Filing History:

goldMedal24 out of 54,664 
 
Intel Corporation
 patents

Years Active: 2019-2025

where 'Filed Patents' based on already Granted Patents

24 patents (USPTO):
1. 12288744 - Microelectronic assemblies having conductive structures with different thicknesses on a core substrate (2025-04-29),
2. 12224264 - Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate (2025-02-11),
3. 12154715 - Methods to selectively embed magnetic materials in substrate and corresponding structures (2024-11-26),
4. 11901115 - Substrate assembly with encapsulated magnetic feature (2024-02-13),
5. 11842981 - Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate (2023-12-12),
6. 11735537 - Methods to embed magnetic material as first layer on coreless substrates and corresponding structures (2023-08-22),
7. 11557489 - Cavity structures in integrated circuit package supports (2023-01-17),
8. 11508636 - Multi-layer solution based deposition of dielectrics for advanced substrate architectures (2022-11-22),
9. 11450471 - Methods to selectively embed magnetic materials in substrate and corresponding structures (2022-09-20),
10. 11443892 - Substrate assembly with encapsulated magnetic feature (2022-09-13),
11. 11417614 - Methods to embed magnetic material as first layer on coreless substrates and corresponding structures (2022-08-16),
12. 11380609 - Microelectronic assemblies having conductive structures with different thicknesses on a core substrate (2022-07-05),
13. 11355459 - Embedding magnetic material, in a cored or coreless semiconductor package (2022-06-07),
14. 11322290 - Techniques for an inductor at a first level interface (2022-05-03),
15. 11272619 - Apparatus with embedded fine line space in a cavity, and a method for forming the same (2022-03-08),

Title: Innovator Spotlight: Ji Yong Park - Pioneering Inventor in Chandler, AZ

Introduction:

Ji Yong Park, a prolific inventor based in Chandler, AZ, has made significant strides in the tech world with his groundbreaking innovations. With a portfolio boasting 21 patents, Park has established himself as a trailblazer in the field of technology and engineering.

Latest Patents:

Among his impressive array of patents, two recent inventions stand out. The first is a "Substrate Assembly with Encapsulated Magnetic Feature," which revolutionizes inductor technology by incorporating a magnetic feature within a base substrate, enhancing performance and efficiency. The second patent showcases Park's ingenuity in "Die Interconnect Substrates," a design that facilitates seamless connections between semiconductor devices, paving the way for more streamlined electronic systems.

Career Highlights:

Ji Yong Park is a valued member of the esteemed Intel Corporation, a leading player in the semiconductor industry. His role at Intel has enabled him to spearhead cutting-edge projects and contribute to the company's reputation for innovation and excellence.

Collaborations:

Park's collaborative spirit is evident in his professional partnerships with accomplished peers such as Cheng Xu and Junnan Zhao. Together, they have synergized their expertise to tackle complex challenges and deliver inventive solutions that push the boundaries of technological advancement.

Conclusion:

In conclusion, Ji Yong Park's exemplary work ethic, inventive prowess, and collaborative mindset have solidified his position as a distinguished figure in the realm of technology and engineering. His relentless pursuit of innovation continues to inspire and shape the future of the industry, setting a high standard for aspiring inventors worldwide.

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