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For the Inventor, By the Inventor

Chandler, AZ, United States of America

Ji Yong Park

This inventor holds 24 USPTO granted patents and 8 published patent applications, primarily in Semiconductor Packaging. Top assignee: Intel Corporation. Active years: 2019-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ji Yong Park. Retrieved from https://idiyas.com/inventor/ji-yong-park-e6o9483j

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24 

% Patents Active = 100.0

Average Co-Inventor Count = 5.5

ph-index = 2

Forward Citations = 8(Granted Patents)


Company Filing History:

goldMedal24 out of 56,365 
 
Intel Corporation
 patents

Years Active: 2019-2025

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Areas of Expertise:
Microelectronic Assemblies
Die Interconnect Substrates
Magnetic Materials
Coreless Substrates
Thin-Film Capacitors
Inductors
Cavity Structures
Galvanic Corrosion Protection
Advanced Substrate Architectures
Electrical Components
Encapsulated Features
Conductive Structures
24 patents (USPTO):Explore Patents
1. 12288744 - Microelectronic assemblies having conductive structures with different thicknesses on a core substrate (2025-04-29),
2. 12224264 - Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate (2025-02-11),
3. 12154715 - Methods to selectively embed magnetic materials in substrate and corresponding structures (2024-11-26),
4. 11901115 - Substrate assembly with encapsulated magnetic feature (2024-02-13),
5. 11842981 - Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate (2023-12-12),
6. 11735537 - Methods to embed magnetic material as first layer on coreless substrates and corresponding structures (2023-08-22),
7. 11557489 - Cavity structures in integrated circuit package supports (2023-01-17),
8. 11508636 - Multi-layer solution based deposition of dielectrics for advanced substrate architectures (2022-11-22),
9. 11450471 - Methods to selectively embed magnetic materials in substrate and corresponding structures (2022-09-20),
10. 11443892 - Substrate assembly with encapsulated magnetic feature (2022-09-13),
11. 11417614 - Methods to embed magnetic material as first layer on coreless substrates and corresponding structures (2022-08-16),
12. 11380609 - Microelectronic assemblies having conductive structures with different thicknesses on a core substrate (2022-07-05),
13. 11355459 - Embedding magnetic material, in a cored or coreless semiconductor package (2022-06-07),
14. 11322290 - Techniques for an inductor at a first level interface (2022-05-03),
15. 11272619 - Apparatus with embedded fine line space in a cavity, and a method for forming the same (2022-03-08),

Title: Innovator Spotlight: Ji Yong Park - Pioneering Inventor in Chandler, AZ

Introduction:

Ji Yong Park, a prolific inventor based in Chandler, AZ, has made significant strides in the tech world with his groundbreaking innovations. With a portfolio boasting 21 patents, Park has established himself as a trailblazer in the field of technology and engineering.

Latest Patents:

Among his impressive array of patents, two recent inventions stand out. The first is a "Substrate Assembly with Encapsulated Magnetic Feature," which revolutionizes inductor technology by incorporating a magnetic feature within a base substrate, enhancing performance and efficiency. The second patent showcases Park's ingenuity in "Die Interconnect Substrates," a design that facilitates seamless connections between semiconductor devices, paving the way for more streamlined electronic systems.

Career Highlights:

Ji Yong Park is a valued member of the esteemed Intel Corporation, a leading player in the semiconductor industry. His role at Intel has enabled him to spearhead cutting-edge projects and contribute to the company's reputation for innovation and excellence.

Collaborations:

Park's collaborative spirit is evident in his professional partnerships with accomplished peers such as Cheng Xu and Junnan Zhao. Together, they have synergized their expertise to tackle complex challenges and deliver inventive solutions that push the boundaries of technological advancement.

Conclusion:

In conclusion, Ji Yong Park's exemplary work ethic, inventive prowess, and collaborative mindset have solidified his position as a distinguished figure in the realm of technology and engineering. His relentless pursuit of innovation continues to inspire and shape the future of the industry, setting a high standard for aspiring inventors worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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