The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2025
Filed:
May. 12, 2022
Intel Corporation, Santa Clara, CA (US);
Ji Yong Park, Chandler, AZ (US);
Kyu Oh Lee, Chandler, AZ (US);
Yikang Deng, Chandler, AZ (US);
Zhichao Zhang, Chandler, AZ (US);
Liwei Cheng, Chandler, AZ (US);
Andrew James Brown, Phoenix, AZ (US);
Cheng Xu, Chandler, AZ (US);
Jiwei Sun, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a core substrate with a first conductive structure having a first thickness on the core substrate, and a second conductive structure having a second thickness on the core substrate, where the first thickness is different than the second thickness.