Kyu Oh Lee

Title: Innovations by Kyu Oh Lee: A Pioneer in Semiconductor Patents

Introduction

Kyu Oh Lee, based in Chandler, AZ, is an accomplished inventor with an impressive portfolio of 45 patents to his name. His work primarily focuses on advancements in semiconductor technology, contributing to significant innovations in the electronics industry.

Latest Patents

Among his latest contributions, Kyu Oh Lee has developed groundbreaking patents concerning die interconnect substrates and associated semiconductor devices. One notable patent describes a die interconnect substrate that features a bridge die with interconnects linking the die pads. This design ensures electrical isolation between the bridge die and a substrate structure. Additionally, the substrate allows for the attachment of semiconductor dies through well-engineered interface structures that maintain uniform height, optimizing their performance. Another innovation includes a magnetic inductor device that introduces advanced transmission pathways within semiconductor substrates. This patent outlines a unique approach using magnetic materials and conductive layers to enhance electrical pathways in the semiconductor domain.

Career Highlights

Kyu Oh Lee's career is marked by his tenure at Intel Corporation, a leading technology company known for its cutting-edge innovations in semiconductor manufacturing. His extensive work at Intel has positioned him as a key contributor to the advancement of semiconductor technology, paving the way for more efficient and compact electronic devices.

Collaborations

Throughout his career, Kyu Oh Lee has collaborated with distinguished colleagues, including Rahul Jain and Ji Yong Park. These partnerships have fostered a rich environment for innovation, enabling the development of advanced technologies that push the boundaries of what is possible in the semiconductor field.

Conclusion

Kyu Oh Lee stands out as a vital figure in the realm of semiconductor inventions. His prolific contributions, particularly in the area of die interconnect substrates and magnetic inductor devices, demonstrate his commitment to technological advancement. With numerous patents and collaborations, Lee continues to influence the future of electronics, embodying the spirit of innovation.