The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2026

Filed:

Mar. 29, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Numair Ahmed, Chandler, AZ (US);

Cary Kuliasha, Mesa, AZ (US);

Kyu Oh Lee, Chandler, AZ (US);

Jung Kyu Han, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/64 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H10D 1/20 (2025.01); H10W 44/00 (2026.01); H10W 70/05 (2026.01); H10W 70/63 (2026.01); H10W 70/65 (2026.01);
U.S. Cl.
CPC ...
H10W 44/501 (2026.01); H10D 1/20 (2025.01); H10W 70/095 (2026.01); H10W 70/635 (2026.01); H10W 70/65 (2026.01);
Abstract

A substrate for an electronic device may include a core. The substrate may include a passive electronic component. For instance, the substrate may include a continuous layer of molding material encapsulating the passive electronic component within the core. One or more through vias may extend between a first surface of the core and a second surface of the core. The substrate may include one or more layers coupled with the core. One or more component terminals may facilitate electrical communication between the passive electronic component and one or more of the first layer or the second layer.


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