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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12224253 B1

PDFFull Text
Date of Patent:
Feb. 11, 2025

Filed:

Sep. 20, 2021

Magnetic inductor device and method

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Xin Ning, Tigard, OR (US);

Brandon C. Marin, Gilbert, AZ (US);

Kyu Oh Lee, Chandler, AZ (US);

Siddharth K. Alur, Chandler, AZ (US);

Numair Ahmed, Chandler, AZ (US);

Brent Williams, Chandler, AZ (US);

Mollie Stewart, Scottsdale, AZ (US);

Nathan Ou, Chandler, AZ (US);

Cary Kuliasha, Mesa, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Alliance IP, LLC

Primary Examiner:

Nathan W Ha

Int. Cl.
CPC ...
H01L 23/64 (2006.01); H01F 27/28 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/645 (2013.01); H01F 27/2804 (2013.01); H01L 21/486 (2013.01); H01L 23/49827 (2013.01); H01L 23/49866 (2013.01); H01L 28/10 (2013.01);
Abstract

Transmission pathways in substrates, and associated methods are shown. Example transmission pathways include a semiconductor substrate with a core, a dielectric layer fixed on the core, at least one first electrical transmission pathway extending through at least one of the dielectric layer and the core. The first pathway includes a magnetic material disposed within the at least the core of the at least one first electrical transmission pathway, at least one second electrical transmission pathway extending through the magnetic material, a nickel layer disposed on inner circumferential surface of the magnetic material at least within the second electrical transmission pathway, a copper layer disposed on at least the nickel layer within the second electrical transmission pathway. The dielectric spacer or the nickel layer separates the copper layer from the magnetic material. At least one third pathway extends through at least one of the dielectric layer and the core separate from the at least one electrical transmission pathway.

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