The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2022
Filed:
Dec. 27, 2018
Intel Corporation, Santa Clara, CA (US);
Zhimin Wan, Chandler, AZ (US);
Cheng Xu, Chandler, AZ (US);
Yikang Deng, Chandler, AZ (US);
Junnan Zhao, Chandler, AZ (US);
Ying Wang, Chandler, AZ (US);
Chong Zhang, Chandler, AZ (US);
Kyu Oh Lee, Chandler, AZ (US);
Chandra Mohan Jha, Tempe, AZ (US);
Chia-Pin Chiu, Tempe, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Microelectronic assemblies that include a cooling channel, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a surface, a die having a surface, and a fluidic channel between the surface of the die and the surface of the package substrate, wherein a top surface of the fluidic channel is defined by the surface of the die and a bottom surface of the fluidic channel is defined by the surface of the package substrate. In some embodiments, a microelectronic assembly may include a package substrate having a surface; a die having a surface; and an interposer having a fluidic channel between the surface of the die and the surface of the package substrate.