Chia-Pin Chiu

Title: Innovations by Chia-Pin Chiu in Semiconductor Technology

Introduction

Chia-Pin Chiu, based in Tempe, AZ, is a prominent inventor with an impressive portfolio of 108 patents to his name. His work primarily focuses on advancements in semiconductor technology, specifically addressing challenges related to thermal management and cooling architectures in electronic packaging.

Latest Patents

Chiu's latest patents showcase innovative approaches to semiconductor packaging. One notable patent is for a hybrid interposer of glass and silicon designed to reduce thermal crosstalk. This semiconductor package features a hybrid interposer with two distinct regions: a glass or low thermal conductive material region and a silicon or diamond materials region. It incorporates a first die on the glass region and a second die on the silicon region, complemented by an integrated heat spreader to manage heat dissipation effectively. Additionally, the hybrid interposer is equipped with interconnects that enhance connectivity and performance across the differing materials.

Another significant patent involves package designs that enable dual-sided cooling on laser chips. This innovative electronic package design includes a laser chip with surfaces allowing for optimized thermal management through an interposer, enhancing the overall performance and longevity of the laser packages.

Career Highlights

Chia-Pin Chiu has spent a notable portion of his career at Intel Corporation, contributing to the company's reputation for cutting-edge technology in semiconductor solutions. His patents reflect his commitment to enhancing device efficiency, heat management, and overall performance through clever engineering solutions.

Collaborations

Throughout his career, Chiu has collaborated with esteemed coworkers Weng Hong Teh and Deepak Kulkarni. Their combined expertise and teamwork have led to significant advancements in the field of semiconductor technology, paving the way for new innovations and improving existing technologies.

Conclusion

Chia-Pin Chiu's contributions to semiconductor technology are marked by his innovative patents aimed at addressing the critical challenges of thermal management in electronic packaging. His work not only enhances the performance of electronic devices but also sets a standard for future innovations in the industry. As he continues to push the boundaries of technology at Intel Corporation, his influence within the field is undeniable.