This inventor holds 123 USPTO granted patents and 28 published patent applications and 8 EPO patents, primarily in Photonic Integrated Circuits (CPC class H01L2924-12042). Top assignees: Intel Corporation, Altera Corporation. Active years: 1996-2026.
Inventors with similar research interests:
Location History:
- Chandler, AZ (US) (1996 - 2006)
- Tempe, AZ (US) (2003 - 2024)
- Tempe, OR (US) (2024)
Company Filing History:
Years Active: 1996-2026
Areas of Expertise:
Title: Innovations by Chia-Pin Chiu in Semiconductor Technology
Introduction
Chia-Pin Chiu, based in Tempe, AZ, is a prominent inventor with an impressive portfolio of 108 patents to his name. His work primarily focuses on advancements in semiconductor technology, specifically addressing challenges related to thermal management and cooling architectures in electronic packaging.
Latest Patents
Chiu's latest patents showcase innovative approaches to semiconductor packaging. One notable patent is for a hybrid interposer of glass and silicon designed to reduce thermal crosstalk. This semiconductor package features a hybrid interposer with two distinct regions: a glass or low thermal conductive material region and a silicon or diamond materials region. It incorporates a first die on the glass region and a second die on the silicon region, complemented by an integrated heat spreader to manage heat dissipation effectively. Additionally, the hybrid interposer is equipped with interconnects that enhance connectivity and performance across the differing materials.
Another significant patent involves package designs that enable dual-sided cooling on laser chips. This innovative electronic package design includes a laser chip with surfaces allowing for optimized thermal management through an interposer, enhancing the overall performance and longevity of the laser packages.
Career Highlights
Chia-Pin Chiu has spent a notable portion of his career at Intel Corporation, contributing to the company's reputation for cutting-edge technology in semiconductor solutions. His patents reflect his commitment to enhancing device efficiency, heat management, and overall performance through clever engineering solutions.
Collaborations
Throughout his career, Chiu has collaborated with esteemed coworkers Weng Hong Teh and Deepak Kulkarni. Their combined expertise and teamwork have led to significant advancements in the field of semiconductor technology, paving the way for new innovations and improving existing technologies.
Conclusion
Chia-Pin Chiu's contributions to semiconductor technology are marked by his innovative patents aimed at addressing the critical challenges of thermal management in electronic packaging. His work not only enhances the performance of electronic devices but also sets a standard for future innovations in the industry. As he continues to push the boundaries of technology at Intel Corporation, his influence within the field is undeniable.