The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2025

Filed:

Mar. 31, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Chia-Pin Chiu, Tempe, AZ (US);

Kaveh Hosseini, Livermore, CA (US);

Omkar Karhade, Chandler, AZ (US);

Tim Tri Hoang, San Jose, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/01 (2006.01); G02B 6/293 (2006.01);
U.S. Cl.
CPC ...
G02F 1/0147 (2013.01); G02B 6/29395 (2013.01); G02B 6/2934 (2013.01); G02F 2203/15 (2013.01);
Abstract

Embodiments disclosed herein include optoelectronic systems and methods of forming such systems. In an embodiment, an optoelectronic system comprises a first substrate, a second substrate over the first substrate, a micro-ring resonator (MRR) over the second substrate, a heater integrated into the MRR, a cladding over the MRR, an opening through the first substrate and the second substrate to expose a bottom surface of the MRR, and a base spanning across the opening.


Find Patent Forward Citations

Chiu, Chia-Pin. (2025). Undercut design with a bonded base cover for friendly assembly and effective thermal tuning of micro-ring resonator (mrr) in open cavity photonic integrated chips (ocpic) (U.S. Patent No. 12436413). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12436413

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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