The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2025
Filed:
Jun. 10, 2021
Intel Corporation, Santa Clara, CA (US);
Omkar Karhade, Chandler, AZ (US);
Tolga Acikalin, San Jose, CA (US);
Sushrutha Gujjula, Chandler, AZ (US);
Kelly Lofgreen, Phoenix, AZ (US);
Ravindranath Mahajan, Chandler, AZ (US);
Chia-pin Chiu, Tempe, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An electronic assembly, such as an integrated circuit package, may be formed comprising a package substrate and a photonic integrated circuit device attached thereto, wherein the package substrate includes a heat dissipation structure disposed therein. A back surface of the photonic integrated circuit device may thermally coupled to the heat dissipation structure within the package substrate for the removal of heat from the photonic integrated circuit device, which allows for access to an active surface of the photonic integrated circuit device for the attachment of fiber optic cables and eliminates the need for a heat dissipation device to be thermally attached to the active surface of the photonic integrated circuit device.