The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2025
Filed:
Jun. 23, 2021
Intel Corporation, Santa Clara, CA (US);
Jin Yang, Hillsboro, OR (US);
Jimmy Chuang, Taipei, TW;
Xicai Jing, Shanghai, CN;
Yuan-Liang Li, Taipei, TW;
Yuyang Xia, Shanghai, CN;
David Shia, Portland, OR (US);
Mohanraj Prabhugoud, Hillsboro, OR (US);
Maria De La Luz Belmont, Zapopan, MX;
Oscar Farias Moguel, Morelia, MX;
Andres Ramirez Macias, Zapopan, MX;
Javier Avalos Garcia, Zapopan, MX;
Jessica Gullbrand, Hillsboro, OR (US);
Shaorong Zhou, Shanghai, CN;
Chia-Pin Chiu, Tempe, AZ (US);
Xiaojin Gu, Shanghai Zizhu Science Park, CN;
Intel Corporation, Santa Clara, CA (US);
Abstract
An apparatus is described. The apparatus includes a packaged semiconductor device. The packaged semiconductor device having an integrated heat spreader, wherein, a boiling enhancement structure exists on the integrated heat spreader without a block mass residing between the boiling enhancement structure and the integrated heat spreader. The boiling enhancement structure has a structured non-planar surface to promote bubble nucleation in an immersion cooling system.