The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2024
Filed:
Oct. 21, 2020
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventor:
Chia-Pin Chiu, Tempe, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 3/04 (2006.01); H01S 5/023 (2021.01); H01S 5/024 (2006.01); H01S 5/042 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02476 (2013.01); H01S 5/023 (2021.01); H01S 5/02415 (2013.01); H01S 5/02423 (2013.01); H01S 5/02461 (2013.01); H01S 5/02469 (2013.01); H01S 5/04256 (2019.08);
Abstract
Embodiments disclosed herein include dual sided cooling architectures for laser packages. In an embodiment, an electronic package comprises a package substrate, and a laser chip attached to the package substrate. In an embodiment, the laser chip has a first surface and a second surface opposite from the first surface. In an embodiment, an interposer is disposed over the laser chip, where the interposer overhangs an edge of the laser chip. In an embodiment, the electronic package further comprises an interconnect between the interposer and the package substrate.