Chong Zhang

This inventor holds 41 USPTO granted patents and 22 published patent applications and 5 EPO patents, primarily in Microelectronic Packaging. Top assignees: Intel Corporation, Ayar Labs, Inc., Tahoe Research, Ltd.. Active years: 2015-2026.

USPTO Granted Patents = 41 (Patent Applications = 22)

% Patents Active = 95.1

EPO Patents = 5 (Patent Applications = 3)

Average Co-Inventor Count = 4.3

ph-index = 5

Forward Citations = 156(Granted Patents)

Location History:

Chandler, AZ (US) (2015 - 2024)
San Jose, CA (US) (2021 - 2024)

Company Filing History:

Years Active: 2015-2026

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Areas of Expertise:

Film Capacitor

Optical Waveguide

Microelectronic Assemblies

Multi-Chip Packaging

Thermal Management

Integrated Capacitor

Magnetic Structures

3D Conductive Ink

Inductor Techniques

Acousto-Optics

High Density Interconnect

Die Attach Materials

41 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12681245 - Direct silicon-to-silicon bonding for fiber-first packaging process (2026-07-14),

2. 12656556 - Reflowable optical fiber connector (2026-06-16),

3. 12620534 - Film capacitor on a glass substrate (2026-05-05),

4. 12568831 - Patternable die attach materials and processes for patterning (2026-03-03),

5. 12422632 - Systems and methods for passively-aligned optical waveguide edge-coupling (2025-09-23),

6. 12087746 - Microelectronic assemblies having an integrated capacitor (2024-09-10),

7. 12019269 - Multi-chip packaging of silicon photonics (2024-06-25),

8. 11923312 - Patternable die attach materials and processes for patterning (2024-03-05),

9. 11914203 - Hybrid multi-wavelength source and associated methods (2024-02-27),

10. 11899251 - Vertical integrated photonics chiplet for in-package optical interconnect (2024-02-13),

11. 11762154 - Systems and methods for passively-aligned optical waveguide edge-coupling (2023-09-19),

12. 11721677 - Microelectronic assemblies having an integrated capacitor (2023-08-08),

13. 11705389 - Vias for package substrates (2023-07-18),

14. 11696407 - Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrate (2023-07-04),

15. 11646254 - Electronic device including a lateral trace (2023-05-09),

Title: The Innovative Journey of Chong Zhang

Introduction: Chong Zhang, a talented inventor based in Chandler, AZ, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: Chong Zhang holds several patents in the areas of artificial intelligence, renewable energy, and advanced robotics, showcasing his diverse range of expertise.

Career Highlights: With a background in engineering and a passion for problem-solving, Chong Zhang has led successful projects that have revolutionized industries and improved efficiency in various sectors.

Collaborations: Throughout his career, Chong Zhang has collaborated with leading research institutions, universities, and tech companies to bring his ideas to life and create impactful solutions for complex challenges.

Conclusion: Chong Zhang's dedication to innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology.