The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2026
Filed:
Dec. 21, 2021
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Chong Zhang, San Jose, CA (US);
Cheng Xu, Chandler, AZ (US);
Junnan Zhao, San Jose, CA (US);
Ying Wang, Chandler, AZ (US);
Meizi Jiao, San Jose, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/33 (2006.01); H01G 4/008 (2006.01); H01G 4/12 (2006.01); H01G 4/224 (2006.01); H10D 1/68 (2025.01); H10D 86/85 (2025.01);
U.S. Cl.
CPC ...
H01G 4/33 (2013.01); H01G 4/008 (2013.01); H01G 4/1209 (2013.01); H01G 4/224 (2013.01); H10D 1/696 (2025.01); H10D 86/85 (2025.01);
Abstract
Embodiments herein relate to systems, apparatuses, or processes directed to packages that include one or more glass cores that have thin film capacitors on one or more sides of the one or more glass cores. The film capacitors may be formed in-situ on the glass cores during substrate manufacturing. Other embodiments may be described and/or claimed.