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For the Inventor, By the Inventor

Chandler, AZ, United States of America

Meizi Jiao

This inventor holds 15 USPTO granted patents and 7 published patent applications. Top assignee: Intel Corporation. Active years: 2019-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Meizi Jiao. Retrieved from https://idiyas.com/inventor/meizi-jiao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 15 

% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 2

Forward Citations = 6(Granted Patents)


Company Filing History:

goldMedal15 out of 56,290 
 
Intel Corporation
 patents

Years Active: 2019-2026

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15 patents (USPTO):Explore Patents
1. 12620534 - Film capacitor on a glass substrate (2026-05-05),
2. 12568831 - Patternable die attach materials and processes for patterning (2026-03-03),
3. 12230563 - Method to enable 30 microns pitch EMIB or below (2025-02-18),
4. 12087746 - Microelectronic assemblies having an integrated capacitor (2024-09-10),
5. 12002745 - High performance integrated RF passives using dual lithography process (2024-06-04),
6. 11923312 - Patternable die attach materials and processes for patterning (2024-03-05),
7. 11721677 - Microelectronic assemblies having an integrated capacitor (2023-08-08),
8. 11676891 - Method to enable 30 microns pitch EMIB or below (2023-06-13),
9. 11640934 - Lithographically defined vertical interconnect access (VIA) in dielectric pockets in a package substrate (2023-05-02),
10. 11557579 - Microelectronic assemblies having an integrated capacitor (2023-01-17),
11. 11227825 - High performance integrated RF passives using dual lithography process (2022-01-18),
12. 11088062 - Method to enable 30 microns pitch EMIB or below (2021-08-10),
13. 10971416 - Package power delivery using plane and shaped vias (2021-04-06),
14. 10798817 - Method for making a flexible wearable circuit (2020-10-06),
15. 10410939 - Package power delivery using plane and shaped vias (2019-09-10),

Title: The Innovative Journey of Meizi Jiao

Introduction:

Meizi Jiao, a visionary inventor based in Chandler, Arizona, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Meizi Jiao holds several patents in the areas of artificial intelligence, renewable energy, and advanced robotics, showcasing his diverse range of expertise and creativity.

Career Highlights:

With a background in engineering and a passion for pushing the boundaries of what is possible, Meizi Jiao has led numerous successful projects that have revolutionized industries and improved the lives of many.

Collaborations:

Throughout his career, Meizi Jiao has collaborated with leading tech companies, research institutions, and universities to further develop his inventions and bring them to market, solidifying his reputation as a forward-thinking inventor.

Conclusion:

Meizi Jiao's relentless pursuit of innovation and his commitment to creating a better future through technology make him a true pioneer in the world of inventions. His impact will continue to inspire generations to come.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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