The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2024
Filed:
Mar. 27, 2019
Intel Corporation, Santa Clara, CA (US);
Bai Nie, Chandler, AZ (US);
Gang Duan, Chandler, AZ (US);
Srinivas Pietambaram, Chandler, AZ (US);
Jesse Jones, Chandler, AZ (US);
Yosuke Kanaoka, Chandler, AZ (US);
Hongxia Feng, Chandler, AZ (US);
Dingying Xu, Chandler, AZ (US);
Rahul Manepalli, Chandler, AZ (US);
Sameer Paital, Chandler, AZ (US);
Kristof Darmawikarta, Chandler, AZ (US);
Yonggang Li, Chandler, AZ (US);
Meizi Jiao, Chandler, AZ (US);
Chong Zhang, Chandler, AZ (US);
Matthew Tingey, Hillsboro, OR (US);
Jung Kyu Han, Chandler, AZ (US);
Haobo Chen, Gilbert, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A die assembly is disclosed. The die assembly includes a die, one or more die pads on a first surface of the die and a die attach film on the die where the die attach film includes one or more openings that expose the one or more die pads and that extend to one or more edges of the die.