Chandler, AZ, United States of America

Yonggang Li

This inventor holds 51 USPTO granted patents and 29 published patent applications and 3 EPO patents, primarily in Semiconductor Packaging. Top assignees: Intel Corporation, University of Central Florida Research Foundation Inc., Other. Active years: 2004-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yonggang Li. Retrieved from https://idiyas.com/inventor/yonggang-li

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 51 

% Patents Active = 58.8

 

Average Co-Inventor Count = 3.6

ph-index = 7

Forward Citations = 166(Granted Patents)


Location History:

  • Orlando, FL (US) (2004 - 2009)
  • Chandler, AZ (US) (2008 - 2024)

Company Filing History:


Years Active: 2004-2026

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Areas of Expertise:
Die Attach Materials
Semiconductor Packaging
Multichip Integration
Microvia Laser Drilling
Optical Integration
Thin-Film Resistors
Embedded Inductors
Selective Metallization
Laser Projection Patterning
Conductive Route Patterning
RF Filters
Acousto-Optic Deflectors
51 patents (USPTO):Explore Patents

Title: Innovations of Yonggang Li: Pioneering Advances in Microelectronic Devices

Introduction

Yonggang Li, a prolific inventor based in Chandler, AZ, has made significant contributions to the field of microelectronics with an impressive portfolio comprising 42 patents. His work showcases innovative designs and methods that enhance the functionality and efficiency of electronic devices.

Latest Patents

Among his latest patents, Yonggang Li has developed technologies such as substrate embedded magnetic core inductors and methods of making microelectronic devices. This invention focuses on an embedded microelectronic package designed for integrated voltage regulation within microelectronic systems. It features a substrate that includes electrically conductive elements separated by dielectric materials, augmented by a magnetic foil consisting of ferromagnetic alloy ribbons, all strategically integrated to optimize performance.

Another notable innovation pertains to conductive route patterning for electronic substrates. This patent describes a process utilizing laser drilling or lithography tools to form openings in materials, followed by selective metal plating on the sidewalls. Yonggang's approach significantly enhances patterning resolution and feature scaling, achieving up to a 2× improvement in patterning density. These advancements lead to higher aspect ratios for conductive routes, thereby improving signaling, reducing latency, and enhancing yields.

Career Highlights

Throughout his career, Yonggang Li has held influential positions at leading institutions such as Intel Corporation and the University of Central Florida. His tenure at these prestigious organizations has facilitated his groundbreaking research and patent development in microelectronics, contributing to both academia and industry.

Collaborations

Yonggang has had the privilege of collaborating with notable colleagues like Islam A. Salama and Charan K. Gurumurthy. These collaborations have sparked innovative ideas and further propelled advancements in their respective fields.

Conclusion

Yonggang Li's innovative spirit and dedication have led to substantial contributions to the microelectronics sector. With 42 patents to his name, his technological advancements continue to influence the design and manufacturing of microelectronic devices, ensuring that his legacy as a leading inventor endures in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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