The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2025

Filed:

Sep. 23, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Bai Nie, Chandler, AZ (US);

Pooya Tadayon, Portland, OR (US);

Leonel R. Arana, Phoenix, AZ (US);

Yonggang Li, Chandler, AZ (US);

Changhua Liu, Chandler, AZ (US);

Kristof Darmawikarta, Chandler, AZ (US);

Srinivas Venkata Ramanuja Pietambaram, Chandler, AZ (US);

Tarek A. Ibrahim, Mesa, AZ (US);

Hari Mahalingam, San Jose, CA (US);

Benjamin Duong, Phoenix, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); G02B 6/43 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4243 (2013.01); G02B 6/43 (2013.01);
Abstract

Various embodiments disclosed relate to photonic assemblies. The present disclosure includes methods for packaging a photonic assembly, including attaching a bridge die to a glass substrate, attaching an electronic integrated circuit die to the glass substrate and the bridge die, attaching a photonic integrated circuit die to the glass substrate and the bridge die, bonding a coupling adapter to the glass substrate and in situ forming a waveguide in the coupling adapted, the waveguide aligning with the photonic integrated circuit die.


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