IDiyas

For the Inventor, By the Inventor

Chandler, AZ, United States of America

Changhua Liu

USPTO Granted Patents = 16 

 

Average Co-Inventor Count = 5.2

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:

goldMedal16 out of 54,664 
 
Intel Corporation
 patents

Years Active: 2018-2025

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16 patents (USPTO):
1. 12456705 - First layer interconnect first on carrier approach for EMIB patch (2025-10-28),
2. 12449600 - Position controlled waveguides and methods of manufacturing the same (2025-10-21),
3. 12354992 - First layer interconnect first on carrier approach for EMIB patch (2025-07-08),
4. 12345932 - Die last and waveguide last architecture for silicon photonic packaging (2025-07-01),
5. 12341117 - Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates (2025-06-24),
6. 12298572 - Device, method and system for optical communication with a photonic integrated circuit chip and a transverse oriented lens structure (2025-05-13),
7. 12164147 - Device, method and system for optical communication with a waveguide structure and an integrated optical coupler of a photonic integrated circuit chip (2024-12-10),
8. 11837534 - Substrate with variable height conductive and dielectric elements (2023-12-05),
9. 11644757 - Method to achieve tilted patterning with a through resist thickness using projection optics (2023-05-09),
10. 11586112 - Method to achieve tilted patterning with a through resist thickness (2023-02-21),
11. 11506982 - Prism-mask for angled patterning applications (2022-11-22),
12. 11264307 - Dual-damascene zero-misalignment-via process for semiconductor packaging (2022-03-01),
13. 11088103 - First layer interconnect first on carrier approach for EMIB patch (2021-08-10),
14. 10438812 - Anisotropic etching systems and methods using a photochemically enhanced etchant (2019-10-08),
15. 10403564 - Dual-damascene zero-misalignment-via process for semiconductor packaging (2019-09-03),

Title: Changhua Liu: Innovator in Integrated Circuit Technology

Introduction

Changhua Liu is a prominent inventor based in Chandler, AZ, known for his significant contributions to integrated circuit technology. With a total of 16 patents to his name, Liu has made remarkable advancements in the field, particularly while working at Intel Corporation.

Latest Patents

Among his latest patents is the "First layer interconnect first on carrier approach for EMIB patch." This innovative patch structure for integrated circuit packages features a core with a first side facing downwards and a second side facing upwards. The design includes a first solder resist layer that comprises a first layer interconnect and has microbumps for bonding to logic dies. Additionally, a second solder resist layer is formed on the opposite side of the core, facilitating connections with a substrate. Another notable patent is for "Position controlled waveguides and methods of manufacturing the same." This invention includes a substrate with a channel extending from one surface to another, incorporating buffer material and a waveguide with varying indices of refraction.

Career Highlights

Liu's career at Intel Corporation has been marked by his innovative spirit and dedication to advancing technology. His work has not only contributed to the company's success but has also pushed the boundaries of what is possible in integrated circuit design.

Collaborations

Throughout his career, Liu has collaborated with talented individuals such as Leonel R Arana and Aleksandar Aleksov. These collaborations have fostered an environment of creativity and innovation, leading to groundbreaking advancements in their respective fields.

Conclusion

Changhua Liu's contributions to integrated circuit technology exemplify the spirit of innovation. His patents and collaborative efforts continue to influence the industry, showcasing the importance of creativity in technological advancement.

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