The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Jun. 18, 2021
Intel Corporation, Santa Clara, CA (US);
Changhua Liu, Chandler, AZ (US);
Leonel R. Arana, Phoenix, AZ (US);
Jeremy D. Ecton, Gilbert, AZ (US);
Suddhasattwa Nad, Chandler, AZ (US);
Brandon Christian Marin, Gilbert, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Techniques for low- or zero-misaligned vias are disclosed. In one embodiment, a high-photosensitivity layer, a medium-photosensitivity layer, and a low-photosensitivity layer are applied to a substrate and exposed at the same time with use of a multi-tone mask. After being developed, one layer forms a mold for a first via, one layer forms a mold for a conductive trace and a second via, and one layer forms an overhang over the position for the second via. The molds formed by the photosensitive layers are filled with copper and then etched. The overhang prevents the top of the copper infill below the overhang region from being etched. As such, the region under the overhang forms a pillar or column after etching, which can be used as a via. Other embodiments are disclosed.