IDiyas

For the Inventor, By the Inventor

Chandler, AZ, United States of America

Suddhasattwa Nad

USPTO Granted Patents = 29 

Average Co-Inventor Count = 5.3

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:

goldMedal29 out of 54,664 
 
Intel Corporation
 patents

Years Active: 2019-2025

where 'Filed Patents' based on already Granted Patents

29 patents (USPTO):
1. 12476175 - Glass substrates having transverse capacitors for use with semiconductor packages and related methods (2025-11-18),
2. 12412868 - Microelectronic assemblies including interconnects with different solder materials (2025-09-09),
3. 12349282 - Capacitors in through glass vias (2025-07-01),
4. 12255147 - Electronic substrate having an embedded etch stop to control cavity depth in glass layers therein (2025-03-18),
5. 12224103 - Angled inductor with small form factor (2025-02-11),
6. 12159825 - Dielectric-to-metal adhesion promotion material (2024-12-03),
7. 12074102 - Structural elements for application specific electronic device packages (2024-08-27),
8. 12033930 - Selectively roughened copper architectures for low insertion loss conductive features (2024-07-09),
9. 12027466 - Conductive route patterning for electronic substrates (2024-07-02),
10. 12002745 - High performance integrated RF passives using dual lithography process (2024-06-04),
11. 11948848 - Subtractive etch resolution implementing a functional thin metal resist (2024-04-02),
12. 11942334 - Microelectronic assemblies having conductive structures with different thicknesses (2024-03-26),
13. 11817349 - Conductive route patterning for electronic substrates (2023-11-14),
14. 11721650 - Method for fabricating multiplexed hollow waveguides of variable type on a semiconductor package (2023-08-08),
15. 11694898 - Hybrid fine line spacing architecture for bump pitch scaling (2023-07-04),

Title: A Glimpse into the Innovation of Inventor Suddhasattwa Nad

Introduction: Suddhasattwa Nad is a prolific inventor based in Chandler, AZ (US) with an impressive portfolio of 19 patents to his name. His groundbreaking work revolves around electronic packages and microelectronic assemblies, showcasing his expertise and creativity in the field of technology.

Latest Patents: Among his latest patents is the "Subtractive etch resolution implementing a functional thin metal resist", which introduces electronic packages and methods for their formation. This innovation includes a substrate, a conductive feature, and a metallic mask that extends beyond the edges of the conductive feature. Another notable patent is the development of microelectronic assemblies with conductive structures of varying thicknesses, demonstrating his versatility in creating novel solutions.

Career Highlights: Suddhasattwa Nad is a valuable asset to Intel Corporation, where he channels his inventive spirit into tangible technological advancements. His dedication to pushing boundaries and exploring new possibilities has led to the successful implementation of several groundbreaking ideas within the company.

Collaborations: Within Intel Corporation, Suddhasattwa Nad collaborates closely with accomplished individuals such as Rahul N Manepalli and Jeremy D Ecton. Together, they form a dynamic team that thrives on innovation and teamwork, shaping the future of technology through their collective expertise and vision.

Conclusion: In conclusion, Suddhasattwa Nad stands as a beacon of innovation in the realm of electronic packages and microelectronic assemblies. His contributions to the field have not only earned him numerous patents but have also inspired his peers and colleagues to strive for excellence in their own pursuits. As he continues to redefine the boundaries of technology, the world eagerly anticipates the next wave of inventions from this visionary inventor.

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