The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
Sep. 01, 2022
Intel Corporation, Santa Clara, CA (US);
Brandon C. Marin, Gilbert, AZ (US);
Kristof Kuwawi Darmawikarta, Chandler, AZ (US);
Srinivas V. Pietambaram, Chandler, AZ (US);
Gang Duan, Chandler, AZ (US);
Benjamin T. Duong, Phoenix, AZ (US);
Suddhasattwa Nad, Chandler, AZ (US);
Jeremy Ecton, Gilbert, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments of a microelectronic assembly comprise: a package substrate including a first integrated circuit (IC) die embedded therein; and a second IC die coupled to the package substrate and conductively coupled to the first IC die by vias in the package substrate. The package substrate has a first side and an opposing second side, the second IC die is coupled to the first side of the package substrate, the first IC die is between the first side of the package substrate and the second side of the package substrate, the package substrate comprises a plurality of layers of conductive traces in an organic dielectric material, the first IC die is surrounded by the organic dielectric material of the package substrate, the vias are in the organic dielectric material between the first IC die and the first side of the package substrate, and the first IC die comprises through-substrate vias.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile