The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2023
Filed:
Dec. 29, 2017
Intel Corporation, Santa Clara, CA (US);
Aleksandar Aleksov, Chandler, AZ (US);
Kristof Darmawikarta, Chandler, AZ (US);
Haobo Chen, Gilbert, AZ (US);
Changhua Liu, Chandler, AZ (US);
Sri Ranga Sai Boyapati, Chandler, AZ (US);
Bai Nie, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Apparatuses, systems and methods associated with package substrate design with variable height conductive elements within a single layer are disclosed herein. In embodiments, a substrate may include a first layer, wherein a trench is located in the first layer, and a second layer located on a surface of the first layer. The substrate may further include a first conductive element located in a first portion of the second layer adjacent to the trench, wherein the first conductive element extends to fill the trench, and a second conductive element located in a second portion of the second layer, wherein the second conductive element is located on the surface of the first layer. Other embodiments may be described and/or claimed.