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For the Inventor, By the Inventor

Chandler, AZ, United States of America

Sri Ranga Sai Boyapati

USPTO Granted Patents = 63 

 

Average Co-Inventor Count = 5.1

ph-index = 5

Forward Citations = 134(Granted Patents)

Forward Citations (Not Self Cited) = 119(Dec 10, 2025)


Inventors with similar research interests:


Company Filing History:

goldMedal62 out of 54,688 
 
Intel Corporation
 patents
silverMedal1 out of 82 
 
Tahoe Research, Ltd.
 patents

Years Active: 2016-2025

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Areas of Expertise:
Faraday Rotator Interconnect
Magneto-Optical Kerr Effect
Multi-Chip Package
High Density Interconnects
Microelectronic Device
Embedded Die Substrate
In-Package RF Waveguides
Panel Level Packaging
Electromigration Resistant Arrays
Lithographic Via Formation
Substrate Integrated Waveguide
Coaxial Interconnect
63 patents (USPTO):Explore Patents
1. 12481108 - Faraday rotator interconnect as a through-via configuration in a patch architecture (2025-11-25),
2. 12253722 - Magneto-optical Kerr effect interconnects for photonic packaging (2025-03-18),
3. 12218071 - Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers (2025-02-04),
4. 12218069 - Multi-chip package with high density interconnects (2025-02-04),
5. 12176223 - Integrated circuit package supports (2024-12-24),
6. 12046560 - Microelectronic device with embedded die substrate on interposer (2024-07-23),
7. 11935857 - Surface finishes with low RBTV for fine and mixed bump pitch architectures (2024-03-19),
8. 11923307 - Microelectronic structures including bridges (2024-03-05),
9. 11908821 - Sacrificial dielectric for lithographic via formation to enable via scaling in high density interconnect packaging (2024-02-20),
10. 11908802 - Multi-chip package with high density interconnects (2024-02-20),
11. 11894324 - In-package RF waveguides as high bandwidth chip-to-chip interconnects and methods for using the same (2024-02-06),
12. 11894311 - Microelectronic device with embedded die substrate on interposer (2024-02-06),
13. 11862619 - Patch accommodating embedded dies having different thicknesses (2024-01-02),
14. 11854834 - Integrated circuit package supports (2023-12-26),
15. 11837534 - Substrate with variable height conductive and dielectric elements (2023-12-05),

Title: The Innovative Journey of Sri Ranga Sai Boyapati

Introduction:

Sri Ranga Sai Boyapati, a talented inventor based in Chandler, AZ, has been making significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Sri Ranga Sai Boyapati holds several patents in the areas of artificial intelligence, renewable energy, and medical devices, showcasing his diverse range of expertise and creativity.

Career Highlights:

With a background in engineering and a passion for problem-solving, Boyapati has successfully developed cutting-edge solutions that have the potential to revolutionize industries and improve the quality of life for many.

Collaborations:

Throughout his career, Sri Ranga Sai Boyapati has collaborated with leading research institutions, universities, and tech companies to bring his inventions to life, demonstrating his ability to work effectively in multidisciplinary teams.

Conclusion:

In conclusion, Sri Ranga Sai Boyapati stands out as a visionary inventor who continues to push the boundaries of innovation, inspiring others in the field to think outside the box and create a better future for all.

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