logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11862619 B1

PDFFull Text
Date of Patent:
Jan. 02, 2024

Filed:

Dec. 29, 2017

Patch accommodating embedded dies having different thicknesses

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Srinivas Pietambaram, Gilbert, AZ (US);

Robert Alan May, Chandler, AZ (US);

Kristof Darmawikarta, Chandler, AZ (US);

Hiroki Tanaka, Chandler, AZ (US);

Rahul N. Manepalli, Chandler, AZ (US);

Sri Ranga Sai Boyapati, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Schwabe, Williamson & Wyatt, P.C.

Primary Examiner:

Phat X Cao

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01); H01L 25/00 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 21/486 (2013.01); H01L 23/49816 (2013.01); H01L 23/49866 (2013.01); H01L 23/5385 (2013.01); H01L 23/5389 (2013.01); H01L 25/0652 (2013.01); H01L 24/14 (2013.01); H01L 2224/1403 (2013.01);
Abstract

Techniques for a patch to couple one or more surface dies to an interposer or motherboard are provided. In an example, the patch can include multiple embedded dies. In an example, a microelectronic device can be formed to include a patch on an interposer, where the patch can include multiple embedded dies and each die can have a different thickness.

Find Patent Forward Citations

Quick Actions:

Pietambaram, Srinivas. (2024). Patch accommodating embedded dies having different thicknesses (U.S. Patent No. 11862619). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11862619

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…