The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2023
Filed:
Feb. 22, 2022
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Kristof Kuwawi Darmawikarta, Chandler, AZ (US);
Robert May, Chandler, AZ (US);
Sri Ranga Sai Boyapati, Chandler, AZ (US);
Srinivas V. Pietambaram, Chandler, AZ (US);
Chung Kwang Christopher Tan, Portland, OR (US);
Aleksandar Aleksov, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4857 (2013.01); H01L 21/481 (2013.01); H01L 21/486 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01);
Abstract
Disclosed herein are integrated circuit (IC) package supports and related apparatuses and methods. For example, in some embodiments, an IC package support may include a non-photoimageable dielectric, and a conductive via through the non-photoimageable dielectric, wherein the conductive via has a diameter that is less than 20 microns. Other embodiments are also disclosed.