The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2024
Filed:
Nov. 16, 2021
In-package rf waveguides as high bandwidth chip-to-chip interconnects and methods for using the same
Intel Corporation, Santa Clara, CA (US);
Aleksandar Aleksov, Chandler, AZ (US);
Telesphor Kamgaing, Chandler, AZ (US);
Sri Ranga Sai Boyapati, Chandler, AZ (US);
Kristof Darmawikarta, Chandler, AZ (US);
Eyal Fayneh, Givatayim, IL;
Ofir Degani, Haifa, IL;
David Levy, Haifa, IL;
Johanna M. Swan, Scottsdale, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
In-package radio frequency (RF) waveguides as high bandwidth chip-to-chip interconnects and methods for using the same are disclosed. In one example, an electronic package includes a package substrate, first and second silicon dies or tiles, and an RF waveguide. The first and second silicon dies or tiles are attached to the package substrate. The RF waveguide is formed in the package substrate and interconnects the first silicon die or tile with the second silicon die or tile.