Sameer Paital

Title: Sameer Paital: Innovator in Electronic Packaging Technology

Introduction

Sameer Paital is a prominent inventor based in Chandler, AZ (US), known for his significant contributions to electronic packaging technology. With a total of 11 patents to his name, Paital has made remarkable advancements in the field, particularly in the area of embedded multi-interconnect bridges.

Latest Patents

One of his latest patents is titled "Lithographic cavity formation to enable EMIB bump pitch scaling." This invention includes an electronic package with an embedded multi-interconnect bridge (EMIB) and outlines methods for creating such packages. The patent describes a structure comprising a first layer made of organic material and a second layer positioned above it. A cavity is formed through the second layer to reveal the first surface of the first layer. A bridge substrate is placed within this cavity, supported by the first surface. The design also includes a first die positioned over the second layer, which is electrically connected to a first contact on the bridge substrate, and a second die that connects to a second contact on the bridge substrate. Notably, the first die is electrically coupled to the second die via the bridge substrate.

Career Highlights

Sameer Paital has established a successful career at Intel Corporation, where he has been instrumental in developing innovative electronic packaging solutions. His work has significantly impacted the efficiency and performance of electronic devices.

Collaborations

Throughout his career, Paital has collaborated with notable colleagues, including Kristof Darmawikarta and Srinivas V Pietambaram. These partnerships have fostered a creative environment that has led to groundbreaking advancements in technology.

Conclusion

Sameer Paital's contributions to electronic packaging technology exemplify his innovative spirit and dedication to advancing the field. His patents and collaborations continue to influence the industry, making him a key figure in the realm of electronic innovations.