The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Jun. 23, 2022
Intel Corporation, Santa Clara, CA (US);
Sameer Paital, Chandler, AZ (US);
Gang Duan, Chandler, AZ (US);
Srinivas V. Pietambaram, Chandler, AZ (US);
Kristof Kuwawi Darmawikarta, Chandler, AZ (US);
Tchefor Ndukum, Chandler, AZ (US);
Vejayakumaran Padavettan, Kulim, MY;
Pooja Wadhwa, Chandler, AZ (US);
Brandon C. Marin, Gilbert, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments of a microelectronic assembly comprise an interposer comprising a dielectric material and a pad of conductive material having at least one of a ceramic liner and fin structures; at least two integrated circuit (IC) dies coupled to the interposer; and a bridge die in the interposer conductively coupled to the at least two IC dies. The bridge die has a first face and an opposing second face, the first face of the bridge die is proximate to the at least two IC dies, and the second face of the bridge die is in contact with the pad.