The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2023

Filed:

Dec. 22, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Chong Zhang, Chandler, AZ (US);

Ying Wang, Chandler, AZ (US);

Junnan Zhao, Gilbert, AZ (US);

Cheng Xu, Chandler, AZ (US);

Yikang Deng, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H05K 1/16 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/42 (2006.01); H01F 41/04 (2006.01); H01F 27/28 (2006.01); H01F 17/00 (2006.01); H05K 3/06 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/165 (2013.01); H01F 17/0013 (2013.01); H01F 27/2804 (2013.01); H01F 41/041 (2013.01); H01F 41/046 (2013.01); H01L 21/486 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H05K 1/115 (2013.01); H05K 3/0026 (2013.01); H05K 3/0047 (2013.01); H05K 3/422 (2013.01); H01F 2017/002 (2013.01); H01L 23/49816 (2013.01); H01L 24/16 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/1427 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19102 (2013.01); H05K 3/06 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10734 (2013.01); H05K 2203/072 (2013.01); H05K 2203/107 (2013.01);
Abstract

Embodiments may include inductors with embedded magnetic cores and methods of making such inductors. In an embodiment, an integrated circuit package may include an integrated circuit die with a multi-phase voltage regulator electrically coupled to the integrated circuit die. In such embodiments, the multi-phase voltage regulator may include a substrate core and a plurality of inductors. The inductors may include a conductive through-hole disposed through the substrate core and a plugging layer comprising a dielectric material surrounding the conductive through-hole. In an embodiment, a magnetic sheath is formed around the plugging layer. In an embodiment, the magnetic sheath is separated from the plated through hole by the plugging layer. Additionally, a first layer comprising a dielectric material may be disposed over a first surface of the magnetic sheath, and a second layer comprising a dielectric material may be disposed over a second surface of the magnetic sheath.


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