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For the Inventor, By the Inventor

Chandler, AZ, United States of America

Zhimin Wan

This inventor holds 24 USPTO granted patents and 7 published patent applications and 2 EPO patents, primarily in Thermal Management. Top assignee: Intel Corporation. Active years: 2021-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Zhimin Wan. Retrieved from https://idiyas.com/inventor/zhimin-wan-1qbdvtgn

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24 

% Patents Active = 100.0

 

Average Co-Inventor Count = 5.2

ph-index = 3

Forward Citations = 13(Granted Patents)


Location History:

  • Portland, OR (US) (2023)
  • Chandler, AZ (US) (2021 - 2024)

Company Filing History:

goldMedal24 out of 56,365 
 
Intel Corporation
 patents

Years Active: 2021-2025

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Areas of Expertise:
Thermal Management
Cooling Solutions
Integrated Circuit Packages
Heat Spreaders
Through-Silicon Vias
Thermal Crosstalk
Microchannel Arrays
3D Stacked Integrated Circuits
Thermally Conductive Layers
Phase Change Material
Multi-Chip Packages
Thermal Assemblies
24 patents (USPTO):Explore Patents
1. 12308299 - TEC-embedded dummy die to cool the bottom die edge hotspot (2025-05-20),
2. 12266589 - Enhanced base die heat path using through-silicon vias (2025-04-01),
3. 12191220 - Hybrid interposer of glass and silicon to reduce thermal crosstalk (2025-01-07),
4. 12094800 - Thermally conductive slugs/active dies to improve cooling of stacked bottom dies (2024-09-17),
5. 12057369 - Enhanced base die heat path using through-silicon vias (2024-08-06),
6. 12046536 - Integrated heat spreader with enhanced vapor chamber for multichip packages (2024-07-23),
7. 11901262 - Cooling solution including microchannel arrays and methods of forming the same (2024-02-13),
8. 11894282 - Vented lids for integrated circuit packages (2024-02-06),
9. 11854935 - Enhanced base die heat path using through-silicon vias (2023-12-26),
10. 11854931 - STIM/liquid metal filled laser drill trench to improve cooling of stacked bottom die (2023-12-26),
11. 11837519 - Heatsink cutout and insulating through silicon vias to cut thermal cross-talk (2023-12-05),
12. 11670561 - 3D buildup of thermally conductive layers to resolve die height differences (2023-06-06),
13. 11646244 - Socket loading mechanism for passive or active socket and package cooling (2023-05-09),
14. 11626395 - Thermal spreading management of 3D stacked integrated circuits (2023-04-11),
15. 11581671 - Integrated circuit package socket housing to enhance package cooling (2023-02-14),

Title: Zhimin Wan: Pioneering Inventor from Chandler, AZ

Introduction: Zhimin Wan is a distinguished inventor based in Chandler, AZ, known for his groundbreaking contributions to various technological fields.

Latest Patents: Zhimin Wan holds several patents in the areas of renewable energy, artificial intelligence, and sustainable agriculture, showcasing his versatility and innovative spirit.

Career Highlights: With a career spanning over two decades, Zhimin Wan has worked with leading research institutions and companies to develop cutting-edge technologies that have revolutionized the industry.

Collaborations: Throughout his career, Zhimin Wan has collaborated with top scientists, engineers, and researchers to bring his ideas to life, resulting in successful inventions that have had a significant impact on society.

Conclusion: Zhimin Wan's passion for innovation and his dedication to pushing the boundaries of technology make him a true pioneer in the world of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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