The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2024
Filed:
Jun. 19, 2019
Intel Corporation, Santa Clara, CA (US);
Zhimin Wan, Chandler, AZ (US);
Sergio Antonio Chan Arguedas, Chandler, AZ (US);
Peng Li, Chandler, AZ (US);
Chandra Mohan Jha, Tempe, AZ (US);
Aravindha R. Antoniswamy, Phoenix, AZ (US);
Cheng Xu, Chandler, AZ (US);
Junnan Zhao, Gilbert, AZ (US);
Ying Wang, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Disclosed herein are vented lids for integrated circuit (IC) packages, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, and a die between the package substrate and the lid. A vent may extend between the interior surface and the exterior surface of the lid, and the vent may at least partially overlap the die.