IDiyas

For the Inventor, By the Inventor

Phoenix, AZ, United States of America

Aravindha Antoniswamy

USPTO Granted Patents = 12 

Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 18(Granted Patents)


Location History:

  • Chandler, AZ (US) (2016)
  • Phoenix, AZ (US) (2017 - 2024)

Company Filing History:

goldMedal12 out of 54,664 
 
Intel Corporation
 patents

Years Active: 2016-2024

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12 patents (USPTO):
1. 11923268 - Printed heat spreader structures and methods of providing same (2024-03-05),
2. 11894282 - Vented lids for integrated circuit packages (2024-02-06),
3. 11881438 - First-level integration of second-level thermal interface material for integrated circuit assemblies (2024-01-23),
4. 11869824 - Thermal interface structures for integrated circuit packages (2024-01-09),
5. 11581240 - Liquid thermal interface material in electronic packaging (2023-02-14),
6. 11004768 - Multi-chip package with partial integrated heat spreader (2021-05-11),
7. 10969840 - Heat spreaders with interlocked inserts (2021-04-06),
8. 10763188 - Integrated heat spreader having electromagnetically-formed features (2020-09-01),
9. 10236233 - Heat spreaders with integrated preforms (2019-03-19),
10. 9799584 - Heat spreaders with integrated preforms (2017-10-24),
11. 9515003 - Embedded air core inductors for integrated circuit package substrates with thermal conductor (2016-12-06),
12. 9330999 - Multi-component integrated heat spreader for multi-chip packages (2016-05-03),

Title: Innovations by Aravindha Antoniswamy

Introduction

Aravindha Antoniswamy is a prominent inventor based in Phoenix, AZ, known for his significant contributions to the field of integrated circuit technology. With a total of 12 patents to his name, he has developed innovative solutions that enhance heat management in electronic devices.

Latest Patents

Among his latest patents are "Printed heat spreader structures and methods of providing same" and "Vented lids for integrated circuit packages." The first patent focuses on techniques and mechanisms for promoting heat conduction in packaged devices using a heat spreader fabricated through a build-up process. This involves 3D printing of a heat spreader that successively deposits layers of thermal conductor material, conforming to the varying heights of integrated circuit (IC) dies. The second patent introduces vented lids for IC packages, which include a vent that extends between the interior and exterior surfaces of the lid, overlapping the die to improve thermal management.

Career Highlights

Aravindha Antoniswamy is currently employed at Intel Corporation, where he applies his expertise in thermal management and integrated circuit design. His work has been instrumental in advancing the efficiency and performance of electronic devices.

Collaborations

Throughout his career, Antoniswamy has collaborated with notable colleagues, including Thomas John Fitzgerald and Kyle Jordan Arrington. These partnerships have fostered a creative environment that

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