The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2017

Filed:

Nov. 16, 2015
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Aravindha R. Antoniswamy, Phoenix, AZ (US);

Thomas J. Fitzgerald, Phoenix, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/367 (2006.01); B22D 19/00 (2006.01); B22D 31/00 (2006.01); B23K 26/362 (2014.01); F28F 21/00 (2006.01); H01L 21/48 (2006.01); H01L 23/373 (2006.01); F28F 3/02 (2006.01); F28F 21/08 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); B22D 19/00 (2013.01); B22D 31/00 (2013.01); B23K 26/362 (2013.01); F28F 3/02 (2013.01); F28F 21/00 (2013.01); F28F 21/08 (2013.01); H01L 21/4882 (2013.01); H01L 23/3732 (2013.01); H01L 24/83 (2013.01);
Abstract

Embodiments of heat spreaders with integrated preforms, and related devices and methods, are disclosed herein. In some embodiments, a heat spreader may include: a frame formed of a metal material, wherein the metal material is a zinc alloy or an aluminum alloy; a preform secured in the frame, wherein the preform has a thermal conductivity higher than a thermal conductivity of the metal material; and a recess having at least one sidewall formed by the frame. The metal material may have an equiaxed grain structure. In some embodiments, the equiaxed grain structure may be formed by squeeze-casting or rheocasting the metal material.


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