The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2024
Filed:
Nov. 04, 2019
Intel Corporation, Santa Clara, CA (US);
Kyle J. Arrington, Chandler, AZ (US);
Aaron McCann, Chandler, AZ (US);
Kelly Lofgreen, Phoenix, AZ (US);
Elah Bozorg-Grayeli, Chandler, AZ (US);
Aravindha Antoniswamy, Phoenix, AZ (US);
Joseph B. Petrini, Gilbert, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A thermal interface structure may be formed comprising a thermally conductive substrate having a first surface and an opposing second surface, a first liquid metal layer on the first surface of the thermally conductive substrate, and a second liquid metal layer on the second surface of the thermally conductive substrate. The thermal interface structure may be used in an integrated circuit assembly or package between at least one integrated circuit device and a heat dissipation device.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile