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For the Inventor, By the Inventor

Gilbert, AZ, United States of America

Kyle Jordan Arrington

USPTO Granted Patents = 15 

Average Co-Inventor Count = 5.5

ph-index = 1

Forward Citations = 1(Granted Patents)


Location History:

  • Gilbert, AZ (US) (2023 - 2024)
  • Chandler, AZ (US) (2024)

Company Filing History:

goldMedal15 out of 54,664 
 
Intel Corporation
 patents

Years Active: 2023-2025

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15 patents (USPTO):
1. 12354883 - Omni directional interconnect with magnetic fillers in mold matrix (2025-07-08),
2. 12349303 - Low force liquid metal interconnect solutions (2025-07-01),
3. 12266589 - Enhanced base die heat path using through-silicon vias (2025-04-01),
4. 12238892 - Immersion cooling for integrated circuit devices (2025-02-25),
5. 12057369 - Enhanced base die heat path using through-silicon vias (2024-08-06),
6. 12046536 - Integrated heat spreader with enhanced vapor chamber for multichip packages (2024-07-23),
7. 11923268 - Printed heat spreader structures and methods of providing same (2024-03-05),
8. 11881438 - First-level integration of second-level thermal interface material for integrated circuit assemblies (2024-01-23),
9. 11869824 - Thermal interface structures for integrated circuit packages (2024-01-09),
10. 11854935 - Enhanced base die heat path using through-silicon vias (2023-12-26),
11. 11842944 - IC assemblies including die perimeter frames suitable for containing thermal interface materials (2023-12-12),
12. 11832419 - Full package vapor chamber with IHS (2023-11-28),
13. 11679407 - Liquid metal thermal interface material application (2023-06-20),
14. 11622466 - Low force liquid metal interconnect solutions (2023-04-04),
15. 11616000 - Methods and apparatus to provide electrical shielding for integrated circuit packages using a thermal interface material (2023-03-28),

Title: Innovator Spotlight: Kyle Jordan Arrington

Introduction: Kyle Jordan Arrington, a distinguished inventor hailing from Gilbert, AZ, is at the forefront of technological advancement in the field of integrated circuit assemblies. With an impressive collection of 8 patents to his name, Kyle's innovative solutions have redefined thermal management in electronic devices.

Latest Patents: Kyle's recent patents showcase his expertise in thermal interface materials for integrated circuit assemblies. One such invention involves the first-level integration of a second-level thermal interface material, enhancing thermal coupling and simplifying assembly processes. Additionally, his thermal interface structures for integrated circuit packages optimize heat dissipation between integrated circuit devices and heat dissipation devices.

Career Highlights: Kyle Jordan Arrington is a vital member of the esteemed Intel Corporation, where his groundbreaking inventions have significantly contributed to the company's technological advancements in the semiconductor industry. His dedication to innovation and problem-solving has earned him recognition as a key player in the development of cutting-edge technologies.

Collaborations: Kyle has collaborated with talented individuals within Intel Corporation, including colleagues such as Aaron McCann and Jerrod Peterson. Together, they have worked on innovative projects that have revolutionized the integration of thermal solutions in electronic devices.

Conclusion: In conclusion, Kyle Jordan Arrington stands as a shining example of a dedicated and visionary inventor, whose contributions continue to shape the landscape of innovation. His pioneering work in thermal management technologies has not only advanced the field of integrated circuit assemblies but has also set new standards for efficiency and performance in the semiconductor industry. Kyle's innovative spirit and strategic collaborations highlight his unwavering commitment to pushing the boundaries of technological innovation.

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