The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Jul. 02, 2022
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Kyle J. Arrington, Gilbert, AZ (US);
Karumbu Nathan Meyyappan, Portland, OR (US);
Srikant Nekkanty, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2023.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 23/49811 (2013.01); H01L 23/5385 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/29 (2013.01); H01L 2224/13105 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13166 (2013.01); H01L 2224/13169 (2013.01); H01L 2224/13184 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81405 (2013.01); H01L 2224/81409 (2013.01); H01L 2224/81411 (2013.01); H01L 2224/81418 (2013.01); H01L 2924/01008 (2013.01); H01L 2924/0665 (2013.01);
Abstract
In one embodiment, an integrated circuit assembly includes a substrate comprising electrical connectors on a top side of the substrate and an integrated circuit die coupled to the top side of the substrate. The integrated circuit die includes metal pillars extending from a bottom side of the die facing the top side of the substrate, and the metal pillars of the integrated circuit die are electrically connected to the electrical connectors of the substrate via a liquid metal (e.g., a Gallium-based alloy).