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For the Inventor, By the Inventor

Chandler, AZ, United States of America

Srikant Nekkanty

This inventor holds 33 USPTO granted patents and 28 published patent applications and 3 EPO patents, primarily in Optical Interconnects. Top assignee: Intel Corporation. Active years: 2015-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Srikant Nekkanty. Retrieved from https://idiyas.com/inventor/srikant-nekkanty

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 33 

% Patents Active = 81.8

 

Average Co-Inventor Count = 4.6

ph-index = 3

Forward Citations = 26(Granted Patents)


Company Filing History:

goldMedal33 out of 56,440 
 
Intel Corporation
 patents

Years Active: 2015-2026

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Areas of Expertise:
Liquid Metal Interconnects
Optical Isolators
Photonic Integrated Circuits
Modular System
Electrical Couplings
High Bandwidth Networking
Passive Alignment
Microelectronic Package
Dual-Sided Socket
Connector Techniques
Ball Grid Array
Small Form Factor
33 patents (USPTO):Explore Patents
1. 12635564 - Liquid metal based first level interconnects (2026-05-19),
2. 12613376 - Optical isolators for multi-channel optical interconnects (2026-04-28),
3. 12523827 - Photonic integrated circuit to glass substrate alignment through dual cylindrical lens (2026-01-13),
4. 12519049 - Liquid metal interconnect for modular system on an interconnect server architecture (2026-01-06),
5. 12506083 - Liquid metal interconnect for modular package server architecture (2025-12-23),
6. 12494435 - Liquid metal interconnect for modular system on an interposer server architecture (2025-12-09),
7. 12493151 - Method and device for fast, passive alignment in photonics assembly (2025-12-09),
8. 12413001 - Heterogenous socket contact for electrical and mechanical performance scaling in a microelectronic package (2025-09-09),
9. 12341281 - Micro socket electrical couplings for dies (2025-06-24),
10. 12298572 - Device, method and system for optical communication with a photonic integrated circuit chip and a transverse oriented lens structure (2025-05-13),
11. 12174436 - Package expanded beam connector for on-package optics (2024-12-24),
12. 12153269 - Active optical coupler (2024-11-26),
13. 12009612 - Dual-sided socket device with corrugation structures and shield structures (2024-06-11),
14. 11935860 - Electrical connector with insulated conductive layer (2024-03-19),
15. 11916322 - Dual-sided socket device with corrugation structures (2024-02-27),

Title: Innovations of Srikant Nekkanty in Optical Communication

Introduction

Srikant Nekkanty, an accomplished inventor based in Chandler, AZ, has made significant contributions to the field of optical communication. With 24 patents to his name, Nekkanty has developed innovative technologies that enhance the efficiency and functionality of photonic integrated circuits.

Latest Patents

One of Srikant Nekkanty’s latest patents is a "Device, method and system for optical communication with a photonic integrated circuit chip and a transverse oriented lens structure." This invention focuses on techniques and mechanisms that facilitate horizontal communication with a PIC chip, featuring a lens structure that is optically coupled to it. The PIC chip consists of integrated circuitry, photonic waveguides, and integrated edge-oriented couplers (IECs) that work together to optimize communication efficiency.

Another recent patent is for a "Package expanded beam connector for on-package optics." This technology discusses photonics packages and systems, incorporating a package substrate with a cutout at its edge where a photonics die is coupled, thereby enhancing the functionality of optical connections in compact designs.

Career Highlights

Srikant Nekkanty is currently associated with Intel Corporation, where he leverages his innovative mindset to drive advancements in optical communication technologies. His work at Intel plays a crucial role in developing cutting-edge solutions that meet the demands of modern optical communication systems.

Collaborations

Throughout his career, Nekkanty has had the opportunity to collaborate with talented individuals such as Donald Tiendung Tran and Zhichao Zhang. These collaborations have likely contributed to the creativity and success of his patent portfolio.

Conclusion

Srikant Nekkanty's work exemplifies the spirit of innovation and progression within the realm of optical communication. His numerous patents reflect a commitment to advancing technology and improving the efficiency of photonic integrated circuits, ensuring that he remains a prominent figure in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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