The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2025
Filed:
Jun. 18, 2021
Intel Corporation, Santa Clara, CA (US);
Zhichao Zhang, Chandler, AZ (US);
Zhe Chen, Chandler, AZ (US);
Steven A. Klein, Chandler, AZ (US);
Feifei Cheng, Chandler, AZ (US);
Srikant Nekkanty, Chandler, AZ (US);
Kemal Aygun, Tempe, AZ (US);
Michael E. Ryan, Fountain Hills, AZ (US);
Pooya Tadayon, Portland, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A microelectronic socket structure and a method of forming the same. The socket structure comprises: a socket structure housing defining a cavity therein; and an interconnection structure including: a contact element disposed at least in part within the cavity, and configured to be electrically coupled to a corresponding microelectronic package, the contact element corresponding to one of a signal contact element or a ground contact element; and a conductive structure disposed at least in part within the cavity, electrically coupled to the contact element, and having an outer contour that is non-conformal with respect to an outer contour of the contact element.