Chandler, AZ, United States of America

Feifei Cheng

This inventor holds 9 USPTO granted patents and 17 published patent applications and 2 EPO patents. Top assignee: Intel Corporation. Active years: 2017-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Feifei Cheng. Retrieved from https://idiyas.com/inventor/feifei-cheng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 9 

% Patents Active = 44.4

 

Average Co-Inventor Count = 5.3

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2017-2025

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9 patents (USPTO):Explore Patents

Title: Feifei Cheng: Innovator in Microelectronic Socket Technology

Introduction

Feifei Cheng is a prominent inventor based in Chandler, AZ, known for her significant contributions to microelectronic socket technology. With a total of nine patents to her name, she has made remarkable advancements in the field, particularly while working at Intel Corporation.

Latest Patents

Among her latest patents is the "Heterogenous socket contact for electrical and mechanical performance scaling in a microelectronic package." This invention features a microelectronic socket structure that includes a housing defining a cavity and an interconnection structure with a contact element designed for electrical coupling to a microelectronic package. The design ensures that the contact element can be either a signal or ground contact element, enhancing the performance of microelectronic packages.

Another notable patent is the "Compression mounted technology (CMT) socket system retention mechanisms designs for shipping reliability risk mitigation." This patent describes socket architectures that include a housing with multiple interconnect pins and alignment features, ensuring the reliability of electronic packages during shipping.

Career Highlights

Feifei Cheng has established herself as a key figure in the microelectronics industry through her innovative designs and patents. Her work at Intel Corporation has positioned her as a leader in developing technologies that improve the performance and reliability of microelectronic packages.

Collaborations

Throughout her career, Feifei has collaborated with notable colleagues, including Kuang C Liu and Thomas A Boyd. These collaborations have further enhanced her contributions to the field and have led to the development of cutting-edge technologies.

Conclusion

Feifei Cheng's innovative work in microelectronic socket technology has significantly impacted the industry. Her patents reflect her dedication to advancing technology and improving the performance of microelectronic packages.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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