The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 26, 2021

Filed:

Mar. 09, 2018
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Feifei Cheng, Chandler, AZ (US);

Emad Al-Momani, Portland, OR (US);

Ahmet Durgun, Chandler, AZ (US);

Kuang Liu, Queen Creek, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 3/00 (2006.01); H01R 12/72 (2011.01); H05K 3/30 (2006.01); H05K 7/10 (2006.01); H01R 12/70 (2011.01); H01R 12/85 (2011.01); H01R 12/88 (2011.01); H01R 24/60 (2011.01); H01R 107/00 (2006.01);
U.S. Cl.
CPC ...
H01R 12/721 (2013.01); H01R 12/7076 (2013.01); H01R 12/85 (2013.01); H05K 3/301 (2013.01); H05K 7/1007 (2013.01); H05K 7/1076 (2013.01); H01R 12/88 (2013.01); H01R 24/60 (2013.01); H01R 2107/00 (2013.01);
Abstract

Apparatuses, systems and methods associated with connector design for mating with integrated circuit packages are disclosed herein. In embodiments, a connector for mating with an integrated circuit (IC) package may include a housing with a recess to receive a portion of the IC package and a contact coupled to the housing and that extends into the recess. The contact may include a main body that extends from the housing into the recess and a curved portion that extends from an end of the main body, wherein the curved portion loops back and contacts the main body. Other embodiments may be described and/or claimed.


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