The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2024
Filed:
Sep. 25, 2020
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Thomas Boyd, Vancouver, WA (US);
Feifei Cheng, Chandler, AZ (US);
Eric W. Buddrius, Hillsboro, OR (US);
Mohanraj Prabhugoud, Beaverton, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/91 (2011.01); H01R 12/70 (2011.01); H01R 12/71 (2011.01); H01R 12/88 (2011.01); H05K 7/10 (2006.01);
U.S. Cl.
CPC ...
H01R 12/91 (2013.01); H01R 12/7005 (2013.01); H01R 12/714 (2013.01); H01R 12/716 (2013.01); H01R 12/88 (2013.01); H05K 7/1069 (2013.01);
Abstract
Embodiments disclosed herein include sockets and electronic packages with socket architectures. In an embodiment, a socket comprises a housing with a first surface and a second surface. In an embodiment, a plurality of interconnect pins pass through the housing. In an embodiment, an alignment hole is provided through the housing. In an embodiment, an alignment post extending out from the first surface of the housing is also provided.