Hillsboro, OR, United States of America

Eric W Buddrius

USPTO Granted Patents = 14 

 

Average Co-Inventor Count = 6.5

ph-index = 3

Forward Citations = 43(Granted Patents)


Location History:

  • Lacey, WA (US) (2016 - 2017)
  • DuPont, WA (US) (2017 - 2020)
  • Hillsboro, OR (US) (2019 - 2023)

Company Filing History:


Years Active: 2016-2025

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14 patents (USPTO):

Title: The Innovations of Eric W. Buddrius: A Pioneer in Processor Technology

Introduction

Eric W. Buddrius, based in Hillsboro, Oregon, is a notable inventor with a remarkable portfolio of 13 patents. His work, primarily in the field of processor loading mechanisms, has contributed significantly to the advancements in semiconductor technology and cooling systems.

Latest Patents

Among his latest patents, two notable inventions stand out:

1. **Technologies for processor loading mechanisms** - This patent discloses techniques designed to optimize the contact between processors and their sockets. By utilizing a heat sink that applies a downward force on the processor, along with a load plate, Buddrius’s invention ensures that the processor remains in optimal physical contact with the socket pins, enhancing thermal efficiency without over-stressing the heat sink.

2. **Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention** - This innovative apparatus includes a back plate designed to support an electronic circuit board while bonding with a thermal cooling mass for semiconductor chip packages. The back plate cleverly incorporates materials of differing stiffness to enhance rigidity and structural integrity. It also features novel designs, such as inner support arms in the bolster plate, to elevate performance.

Career Highlights

Eric W. Buddrius has dedicated his career to Intel Corporation, where he has contributed to numerous innovations in the semiconductor industry. His commitment to advancing technology is reflected in his extensive patent portfolio, showcasing his expertise and creativity in engineering solutions that improve processor performance and efficiency.

Collaborations

Throughout his career, Buddrius has collaborated with esteemed colleagues, including Ralph V. Miele and Thomas A. Boyd. These partnerships have allowed for a rich exchange of ideas, fostering a collaborative environment that drives innovation and leads to the successful creation of cutting-edge technologies.

Conclusion

Eric W. Buddrius stands out as a key player in the field of processor technology, with numerous patents that exemplify his contributions to enhancing semiconductor performance. His continued work at Intel Corporation, along with his collaborations, ensures that his innovations will play a significant role in shaping the future of technology.

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