The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2025
Filed:
Feb. 26, 2021
Intel Corporation, Santa Clara, CA (US);
Ralph V. Miele, Hillsboro, OR (US);
Phil Geng, Washougal, WA (US);
Mengqi Liu, Hillsboro, OR (US);
David Shia, Portland, OR (US);
Sandeep Ahuja, Portland, OR (US);
Eric W. Buddrius, Hillsboro, OR (US);
Jeffory L. Smalley, Olympia, WA (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Techniques for processor loading mechanisms are disclosed. In the illustrative embodiment, a heat sink is in contact with a top surface of a processor, applying a downward force on the processor. A load plate is also in contact with the processor, applying a downward force to the processor as well. The combination of the downward force from the load plate and the heat sink keep the processor in good physical contact with pins of the processor socket. The heat sink has enough force applied to the processor to be in good thermal contact with the processor without applying higher stress to the heat sink. The load plate can apply force to the processor without regard to the thermal characteristics of the load plate. Other embodiments are envisioned and described.