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For the Inventor, By the Inventor

Portland, OR, United States of America

Phil Geng

USPTO Granted Patents = 19 

 

Average Co-Inventor Count = 4.5

ph-index = 3

Forward Citations = 52(Granted Patents)


Location History:

  • Washougal, WA (US) (2023)
  • Portland, OR (US) (2003 - 2024)

Company Filing History:

goldMedal19 out of 54,664 
 
Intel Corporation
 patents

Years Active: 2003-2025

where 'Filed Patents' based on already Granted Patents

19 patents (USPTO):
1. 12476167 - Semiconductor chip package thermo-mechanical cooling assembly (2025-11-18),
2. 12453054 - Cooling assembly with strap element to diminish lateral movement of cooling mass during installation of the cooling mass (2025-10-21),
3. 12334674 - DIMM retention assembly for compression mount technology and land grid array connector loading (2025-06-17),
4. 12315780 - Technologies for processor loading mechanisms (2025-05-27),
5. 12309966 - Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading force (2025-05-20),
6. 12309933 - Magnetically secured semiconductor chip package loading assembly (2025-05-20),
7. 12279395 - Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention (2025-04-14),
8. 12133357 - Cold plate architecture for liquid cooling of devices (2024-10-29),
9. 12131977 - Electronic systems with inverted circuit board with heat sink to chassis attachment (2024-10-29),
10. 11984685 - Retention latch with spring mechanism (2024-05-14),
11. 11842943 - Electronic systems with inverted circuit board with heat sink to chassis attachment (2023-12-12),
12. 11587597 - Connector retention mechanism for improved structural reliability (2023-02-21),
13. 11495518 - Multi-surface heat sink suitable for multi-chip packages (2022-11-08),
14. 10950958 - Memory module connector, memory module, and pivotable latch (2021-03-16),
15. 10888010 - Retention of dual in-line memory modules (2021-01-05),

Title: Phil Geng: Innovator at Intel Corporation

Introduction

Phil Geng, located in Portland, OR, is a prolific inventor with a remarkable record of 19 patents. His work primarily focuses on innovations in semiconductor technology and cooling systems, contributing significantly to advancements in the tech industry.

Latest Patents

Geng's latest innovations include a "Cooling assembly with strap element to diminish lateral movement of cooling mass during installation of the cooling mass" and a "DIMM retention assembly for compression mount technology and land grid array connector loading." The cooling assembly patent describes an apparatus featuring a bolster plate with a strap element aimed at minimizing movement of the cooling mass, ensuring efficient thermal coupling to semiconductor chip packages. The DIMM retention assembly enhances the reliability of memory module connections by providing a robust latch assembly design for compression mount technology and land grid array connectors.

Career Highlights

As a valued employee at Intel Corporation, Geng has played an instrumental role in developing cutting-edge semiconductor technologies. His contributions have helped improve the overall efficiency and performance of numerous products within the organization.

Collaborations

Throughout his career, Phil has collaborated with notable colleagues such as David Shia and Ralph V. Miele. Their combined expertise in technology and engineering has fostered a culture of innovation and excellence within their projects.

Conclusion

Phil Geng's work continues to push the boundaries of technology, making significant contributions to Intel Corporation and the semiconductor industry. His innovative spirit and dedication to improving technology through his inventions pave the way for the next generation of advancements.

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