logo

For the Inventor, By the Inventor

Portland, OR, United States of America

Phil Geng

This inventor holds 23 USPTO granted patents and 28 published patent applications and 4 EPO patents, primarily in Semiconductor Packaging. Top assignee: Intel Corporation. Active years: 2003-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Phil Geng. Retrieved from https://idiyas.com/inventor/phil-geng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 23 

% Patents Active = 100.0

 

Average Co-Inventor Count = 4.5

ph-index = 3

Forward Citations = 56(Granted Patents)


Location History:

  • Washougal, WA (US) (2023)
  • Portland, OR (US) (2003 - 2024)

Company Filing History:

goldMedal23 out of 56,394 
 
Intel Corporation
 patents

Years Active: 2003-2026

Loading Chart...
Loading Chart...
Areas of Expertise:
Socket Interconnect Structures
Cooling Assembly
BGA Stiffener
Thermo-Mechanical Cooling
DIMM Retention Assembly
Magnetically Secured
Thermally Conductive Chamber
Cold Plate Architecture
Multi-Surface Heat Sink
Memory Module Connector
Via-in-Pad Geometry
Electronic Systems
23 patents (USPTO):Explore Patents
1. 12731947 - Socket interconnect structures and related methods (2026-09-08),
2. 12684685 - Cooling assembly with dampened oscillation response (2026-07-14),
3. 12666574 - Multilayer back plate with molded ceramic layer (2026-06-23),
4. 12494441 - BGA stiffener attachment with low Eolife adhesive strength at high solder joint stress area generated from enabling load (2025-12-09),
5. 12476167 - Semiconductor chip package thermo-mechanical cooling assembly (2025-11-18),
6. 12453054 - Cooling assembly with strap element to diminish lateral movement of cooling mass during installation of the cooling mass (2025-10-21),
7. 12334674 - DIMM retention assembly for compression mount technology and land grid array connector loading (2025-06-17),
8. 12315780 - Technologies for processor loading mechanisms (2025-05-27),
9. 12309966 - Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading force (2025-05-20),
10. 12309933 - Magnetically secured semiconductor chip package loading assembly (2025-05-20),
11. 12279395 - Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention (2025-04-14),
12. 12133357 - Cold plate architecture for liquid cooling of devices (2024-10-29),
13. 12131977 - Electronic systems with inverted circuit board with heat sink to chassis attachment (2024-10-29),
14. 11984685 - Retention latch with spring mechanism (2024-05-14),
15. 11842943 - Electronic systems with inverted circuit board with heat sink to chassis attachment (2023-12-12),

Title: Phil Geng: Innovator at Intel Corporation

Introduction

Phil Geng, located in Portland, OR, is a prolific inventor with a remarkable record of 23 patents. His work primarily focuses on innovations in semiconductor technology and cooling systems, contributing significantly to advancements in the tech industry.

Latest Patents

Geng's latest innovations include a "Cooling assembly with strap element to diminish lateral movement of cooling mass during installation of the cooling mass" and a "DIMM retention assembly for compression mount technology and land grid array connector loading." The cooling assembly patent describes an apparatus featuring a bolster plate with a strap element aimed at minimizing movement of the cooling mass, ensuring efficient thermal coupling to semiconductor chip packages. The DIMM retention assembly enhances the reliability of memory module connections by providing a robust latch assembly design for compression mount technology and land grid array connectors.

Career Highlights

As a valued employee at Intel Corporation, Geng has played an instrumental role in developing cutting-edge semiconductor technologies. His contributions have helped improve the overall efficiency and performance of numerous products within the organization.

Collaborations

Throughout his career, Phil has collaborated with notable colleagues such as David Shia and Ralph V. Miele. Their combined expertise in technology and engineering has fostered a culture of innovation and excellence within their projects.

Conclusion

Phil Geng's work continues to push the boundaries of technology, making significant contributions to Intel Corporation and the semiconductor industry. His innovative spirit and dedication to improving technology through his inventions pave the way for the next generation of advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…