The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2025
Filed:
Jul. 20, 2021
Intel Corporation, Santa Clara, CA (US);
Phil Geng, Washougal, WA (US);
Timothy Glen Hanna, Tigard, OR (US);
Xiaoning Ye, Portland, OR (US);
Sandeep Ahuja, Portland, OR (US);
Jacob McMillian, Beaverton, OR (US);
Ralph V. Miele, Hillsboro, OR (US);
David Shia, Portland, OR (US);
Jeffory L. Smalley, Olympia, WA (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An apparatus is described. The apparatus includes a semiconductor chip package loading assembly having a heat sink and a first magnetic material, the first magnetic material to be mechanically coupled to a first side of a printed circuit board that is opposite a second side of the printed circuit board where input/outputs (I/Os) of the semiconductor chip package interface with the printed circuit board. The first magnetic material to be positioned between the printed circuit board and a second magnetic material. The first magnetic material is to be magnetically attracted to the second magnetic material to impede movement of the heat sink.