Sandeep Ahuja

Title: Sandeep Ahuja: Innovating Thermal Solutions for Multi-Chip Packages

Introduction:

Sandeep Ahuja, an accomplished inventor and key member of Intel Corporation, hails from University Place, Washington (US). With 20 patented inventions under his belt, Ahuja has made significant contributions to the field of thermal management for multi-chip packages. In this article, we will delve into his latest patents, highlighting his creativity and expertise in this specialized area.

Latest Patents:

1. Apparatus and Method for Providing a Thermal Parameter Report for a Multi-Chip Package:

One of Ahuja's recent patents focuses on optimizing temperature control in multi-chip packages. This patent describes a processor that comprises power management logic, capable of gathering temperature data from different dies within a package. The power management logic then determines the smallest temperature control margin among multiple temperature control margins. By generating a thermal report that incorporates this information, Ahuja's invention facilitates efficient temperature management within complex chip structures.

2. Multi-Surface Heat Sink Suitable for Multi-Chip Packages:

Another innovative invention by Sandeep Ahuja involves a multi-surface heat sink for multi-chip packages. This apparatus incorporates an integrated circuit die, a heat spreader, a plate element, and a heat sink. The design includes spring and thermal conduit elements, which efficiently dissipate heat across the various surfaces. By improving heat transfer and reducing thermal resistance, Ahuja's invention helps optimize the performance and reliability of multi-chip packages.

Industry Involvement:

Sandeep Ahuja's creative endeavors have primarily been within the Intel Corporation, a globally recognized leader in semiconductor manufacturing. Being associated with such a renowned company allows him to explore cutting-edge technologies and collaborate with diverse experts in the field. The importance of thermal management in high-performance computing has been a crucial focus of Intel, and Ahuja's contributions positively impact the industry.

Collaborators:

During his tenure at Intel Corporation, Sandeep Ahuja had the privilege of working with notable individuals, including Robin A. Steinbrecher and Susan F. Smith. Their collective expertise and contributions enhance the value of Ahuja's innovation and fuel the development of breakthrough technologies.

Conclusion:

Sandeep Ahuja's relentless pursuit of innovative solutions within thermal management for multi-chip packages has yielded remarkable results. With a notable portfolio of patents, his inventions contribute to efficient and reliable computing systems. As part of Intel Corporation, Ahuja's work aligns with the industry's demand for advanced thermal solutions in the evolving landscape of technology.