The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2024
Filed:
Oct. 31, 2023
Intel Corporation, Santa Clara, CA (US);
Barrett M. Faneuf, Beaverton, OR (US);
Phil Geng, Washougal, WA (US);
Kenan Arik, Hillsboro, OR (US);
David Shia, Portland, OR (US);
Casey Winkel, Hillsboro, OR (US);
Sandeep Ahuja, Portland, OR (US);
Eric D. McAfee, Portland, OR (US);
Jeffory L Smalley, East Olympia, WA (US);
Minh T. D. Le, North Plains, OR (US);
Ralph V. Miele, Hillsboro, OR (US);
Marc Milobinski, Scappoose, OR (US);
Aaron P. Anderson, Beaverton, OR (US);
Brendan T. Pavelek, Portland, OR (US);
Carlos Alvizo Flores, Guadalajara, MX;
Fernando Gonzalez Lenero, Zapopan, MX;
Intel Corporation, Santa Clara, CA (US);
Abstract
An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.